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SPECIFICATIONS - PANEL COMPUTERS SERIES X G2
24 INCH
HD 24T22 MMC
TFT Technology Connectors
LED Backlight Technology, Widescreen, RGB vertical stripe, • Ethernet GBLan: 5 x RJ-45
MVA (Multi-domain Vertical Alignment) Technology, TFT Active-matrix • COM RS-232 & 422/485: 1 x DB9M non-isolated (RS mode in BIOS)
Viewable Size and Active Area • USB2.0 (<5m): 2 x USB Type A (4-pin)
• USB3.0 (<3m): 2 x USB Type A (9-pin)
24.0 inch - 531.36 [20.92’’] (H) x 298.89 [11.77’’] (V) mm [inch] • DP++ 1.2 OUT: 1 x DisplayPort Female (Dual-Mode DP++)
Native Resolution and Pixel Pitch • AC Power IN: 1 x Std IEC inlet
• If DC Power IN option: 1 x 2-pin Terminal Block 5.08 (Factory option)
1920 x 1080 (FHD) - 0.276 (H) x 0.276 (V) mm • If CFAST Option: 1 x CFAST Slot
Aspect Ratio and Response Time • If SSD Trays option: 2 x 2.5’’ Sized Tray/Bay (Factory option)
16:9 - 25ms (typ) Product Dimensions and Weight
Light Intensity and Contrast Ratio W:593.00 [23.35’’] x H:384.00 [15.12’’] x D:73.50 [2.89’’] mm [inch]
9.5kg / 20.9lbs
300 cd/m² (typ) - 3000:1 (typ) Product Carton Size and Weight
View Angle / Max Colors L:700.00 [27.56’’] x W:180.00 [7.09’’] x H:565.00 [22.24’’] mm [inch]
89 deg. (up/down/left/right) - 16.7 million TBD kg / TBD lbs (pending)
Synchronization Range Factory Options
31.5 kHz to 91.1 kHz (H) - 60 Hz to 85 Hz (V) • Projected Capacitive Touch Screen (Multitouch,USB,Pen/Glove support)
Optimal Resolution and Hz • Optical Bonding Technology
• Color Calibrated models (ECDIS)
1920 x 1080 @ 60 Hz (If resolution is above/below 1:1, desktop scrolling • Sunlight Readable / High Bright (includes Optical Bonding)
mode will be used) • Multipower (AC+DC) or AC only model
Detectable Resolutions • Model with 2 x physical 2.5’’ removeable Disk Bay/Tray
• Variations of SSD Storage, RAM Memory, Operating System, CPU
640 x 480 to 4096 x 2304 • 1 or 2 x PCA100293-1: 4xCOM RS-422/485 isolated NMEA 4 channel
Power Specifi cations and Consumption • ZIA0001310-B: CAN isolated 2 channel or 2 x 4 channel
• HT 00235 OPT-A1: 2W Amplifi ed Audio out via DB9F
115&230VAC - 50/60Hz • PCA100297-1: Isolated Digital IO module,4 x Output/4 x Input
or Multipower: 115&230VAC - 50/60Hz + 24VDC • PCA100298-1: LAN 10/100Mbps, 2 ports RJ45
TBD W (typ) - TBD W (max) - pending • 1 to 3 x PCA100309-1: Dual Isolated RS-232, connector 2xDB9
Product Features • Q170 IO: 1xNMEA RS422/485 isolated+2xDig. In&Out (Low side switch)
• CFAST Slot
Dimmable 0-100%, Buzzer, Multi-power AC & DC, GPIO, LAN Wakeup,
USB Boot & Wakeup Accessories
Installed Operating System (OS) • JH C01MF A-A: 1 x USB Cable 1m, TypeA-Chassis mount receptacle
None or Standard OS/Customized image, review datasheet for list. • HD VED SX2-D1: 1 x VESA Adapter (75/75, 100/100 & 200/100mm)
(not EN60945 Tested, pending)
Storage Options • HD TMB SX1-C1: 1 x Table Mount Bracket. EN60945 Tested
• HD CMB SX1-B1: 1 x Console Mount Kit. EN60945 Tested
Internal Storage: SSD MLC SATA, Type m.2 • HD 24COV SX1-A1: 1 x UV Sun Cover
Sizes: 150GB (412TBW), 240GB (599TBW), 480GB (945TBW) • P007032: 1 x IP66 Mount Gasket (EPDM), for Flush/Console mount
and/or • HT 00262 OPT-A1: 4 x RS-422/RS-485 isolated, USB ext. module
2 x 2.5’ ‘ Removable Tray. Option: 1 or 2 can be installed of: • HT 00263 OPT-A1: 4 x RS-232 COM non-isolated, USB ext. module
SSD SATA (Multi Level) • HT 00264 OPT-A1: 1 x CAN isolated, 2 channel, USB ext. module
Sizes: 150GB (412TBW), 240GB (599TBW), 480GB (945TBW), • HT 00273 OPT-A1: 4 x Digital IN/OUT isolated, USB ext. module
High Endurance: 200GB (1.1 PBW), 400GB (3.0 PBW) • HT 00274 OPT-A1: 2 x LAN 10/100Mbps, RJ45, USB ext. module
CPU / Processor Options • HT 00300 MSOS: OS options -> http://www.hatteland-display.com/os
1 x Intel® Quad Core™ i5-6500TE, 2.3/3.3GHz, 6MB Cache • HD 000TR SX1-A1: 1 x Removable Front Tray 2.5’’ Empty
or 1 x Intel® Quad Core™ i7-7700T, 2.9/3.8GHz, 8MB Cache • HD xxxyy SX1-z1: 1 x Removable Front Tray 2.5’’ w/Storage Device
or 1 x Intel® Dual Core Celeron™ G3900TE, 2.3/2.3GHz, 2MB Cache Capabilities / Prepared for
Memory Options See Factory Options
2 x 4GB, 8GB, 16GB (260-pin, DDR4-2133, Dual Channel)
Max 32GB (2x16) Operating Temperature
System Chipset / Graphics Chipset -15.0°C / 5.0°F to 55.0°C / 131.0°F, Humidity up to 95%
Intel® GL82Q170 PCH / Storage Temperature
i5-6500TE CPU: Intel® HD Graphics 530
G3900TE CPU: Intel® HD Graphics 510 -30.0°C / -22.0°F to 70.0°C / 158.0°F, Humidity up to 95%
i7-7700T CPU: Intel® HD Graphics 630
BIOS / Speaker / Buzzer IP Rating
EFI, ACPI Support. Preconfi gured by factory / Buzzer: 3500Hz Protection: IP66 front - IP20 rear (EN60529). IP22=option
Onboard PC-Beeper Compass Safe Distance
Power Manager and Monitoring Standard: TBD - Steering: TBD cm [inch] (pending)
AT, ACPI (S3/S4) - Temperature, Fan and voltages status
256 Segments, 0, 1, 2...255 sec/min Type Approval, Testing and Certifi cates
User Controls and Activity IEC 60945 4th (EN 60945:2002)*, IACS E10*, IP66*,
Glass Display Control™ (GDC) IP66 with: Power On/Off, Brightness EU-RO-MR - Mutual Recognition*
*=pending
Control (-/+), Power LED, Mode Status Indicators (ECDIS, HDD, Service),
Buzzer (through glass), Light Sensor (behind glass)
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